I’m a Mechanical Design Engineer with specialized experience in electro-mechanical assemblies, communication systems, and densely packaged electronics. I thrive in both small, multi-disciplinary engineering teams and larger mechanical engineering groups. My expertise includes thermal and structural analysis, CCA & FPC mechanical design, cable design, and statistical tolerance analysis. I have a comprehensive background in designing ruggedized electronic packaging solutions that address high heat dissipation challenges while maintaining robust EMI shielding.
Outside of my professional life, I love to learn more about mechanisms and design projects to improve my personal life. I also enjoy surfing, playing tennis, and making & drinking coffee.
Mechanical Engineer II
Sep 2024 - PresentMechanical Engineer I
Jul 2023 - Sep 2024Mechanical Engineering Intern
Jun 2022 - Jul 2023Designing electromechanical systems from a handheld touch-screen radio to a LEO space radio. Worked in both an agile, multi-disciplinary engineering team, and a large mechanical engineering group. Key focuses and experience highlights:
Key Projects:
Designing a space-grade radio to withstand high shock, vibration, radiation, heat, and decompression
Developed and transitioned to and improved production of a next-generation handheld touchscreen radio.
Designed the radio integration and communication cooling features for the L3Harris VTOL UAS.
Key focuses and experience highlights:
SWaP Engineering: Redesigned multi-band universal transceiver adapter to increase radio compatibility and decrease assembly time, while maintaining the size, EMI shielding, and shipboard vibration & shock requirements.
Thermal Optimization: Designed mounting & heat dissipation system for drone radio — enabling full power operation in both 140°F+ static air environment and in flight, optimized through CFD & FEA.
Manufacturing Excellence: Engineered a precision display installation fixture with ±.002 inch tolerance across dual axes, ensuring consistent alignment and assembly quality.
Vendor Collaboration: Worked with overseas manufacturers to increase touch panel reliability at high temperatures while concurrently implementing new test procedures, increasing yield by 30%.
Electronic Packaging Architecture: Redesigned radio’s CCA mounting structure for spacecraft integration, improving assembly reliability and shock resistance while reducing part costs.
Material Selection: Led effort to replace conductive gaskets and sealants to improve EMI shielding, EMP survivability, assembly & installation, and salt fog corrosion.
RF Mechanical Design: Designed an RF transparent NACA airfoil antenna cover, optimized drag through CFD simulation and RF performance through anechoic chamber testing.
MCAD/ECAD Integration: Improved workflows between ORCAD Schematic, PADS Layout, and SOLIDWORKS for CCAs, PCBs, and flex circuits, streamlining verification processes and improving accuracy across disciplines.
Redesigned radio transit case, achieving 25% spatial efficiency improvement within the original form factor.
Volunteer
Oct 2021 - Jun 2023Responsibilities:
Mentor students in design principles, design feasibility, CAD software, and equipment selection & application.
Teach and train UCSD faculty and students how to operate fabrication tools and equipment.
Computational Fluid Dynamics (CFD)
Finite Element Analysis (FEA)
Statistical Tolerance Analysis
RSS
Monte Carlo
GD&T
Siemens NX
SOLIDWORKS
Onshape
Autodesk Fusion 360
Teamcenter
Solidworks PDM
Design for Manufacturing (DFM)
Design for Assembly (DFA)
Hardware Architecture
MATLAB
Microsoft Excel
Java
JavaScript
Rapid Prototyping
Testing & Verification
FMEA
BS in Mechanical Engineering